A one-page PCB fabrication specification to send to a PCB manufacturer with your Gerber or ODB++ data. It follows the layout manufacturers expect (designation, mechanical, copper, finish, tolerances, special features) and prints to a single A4 page.
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| Title | Revision | ||
| Code | Date | ||
| Project | Designer | ||
| Contact | Checked by |
| External size (mm) | 100.0 × 80.0 | Thickness (mm) | 1.6 |
| PCB type | 4 layers | Quantity | |
| Base material | FR-4, Tg 150 °C min | Panelisation | Single boards (no panel) |
| UL 94V-0 laminate Halogen-free RoHS / REACH compliant UL marking required | |||
| External layers (µm) | 35 (1 oz) | Internal layers - planes (µm) | 35 (1 oz) |
| Hole walls (µm) | 25 | Internal layers - signals (µm) | 35 (1 oz) |
| Soldermask | top bottom Colour: green |
| Silkscreen | top bottom Colour: white |
| Surface finish |
ENIG - Electroless Nickel / Immersion Gold according to IPC-4552
ENIG thicknesses: Ni: 3 µm min - 6 µm max / Au: 0.05 µm min - 0.125 µm max
|
| Marking | Fabricator marking permitted (logo, date code, UL mark) location: any blank space on the PCB |
| Min track width (mm) | 0.15 | Min hole diameter (mm) | 0.30 | Min annular ring (mm) | 0.15 |
| Min track/pad clearance (mm) | 0.15 | Aspect ratio † | 5.3 : 1 | Via protection | None (open vias) |
| Blind and/or buried vias | Via-in-pad | Test coupons required | |||
|
Press-fit through holes
Refer to: |
Specified stack-up
Refer to: |
Controlled impedance
tolerance ±10 %
Refer to: |
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Edge plating / castellations
Refer to: |
Countersink / counterbore holes
Refer to: |
Electrical test (100% netlist) | |||
| Microsection report | Surface finish XRF report | ||||
| Fabrication data | Gerber X2 Gerber RS-274X ODB++ IPC-2581 Excellon drill IPC-D-356 netlist Stack-up drawing | ||||
| Specific features | |||||
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Unusual or design-specific requirements are listed here, with critical items in bold red. Specific base material: <eg. Isola 370HR, or equivalent> Via plugging / fill material: <eg. non-conductive epoxy, planarised and capped; via-in-pad under U3 only> Special plating: <eg. hard gold on edge connector - see call-out on drawings.pdf> Packaging: <eg. vacuum-sealed ESD bags with desiccant and humidity indicator> |
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